Applications
Electric Drivetrain
IGBT Modules
Fuji Electric automotive power modules combine several breakthrough technologies to take power density to a new level.
The unique RC IGBT chips combine the IGBT and the diode in one chip offering very low thermal resistance. Lead frames are used inside the module to connect the chips because of their higher continuous current capability compared to bond wire connections. In combination with a newly developed, powerful, closed water cooler, this results in a very low thermal resistance and a very compact module.
Applications
Hybrid and electric vehicles: Traction inverters for converting HV battery DC into AC for the electric motors.
Main Features Modules
- On-chip current and temperature sensors
- Low thermal resistance
- Excellent heat dissipation
- Simple operating conditions
Main Features RC IGBT
- On-chip current and temperature sensors
- Low thermal resistance
- Excellent heat dissipation
- Simple operating conditions
Main Features Closed water cooler
- Very low thermal resistance and low pressure drop
- Small sealing surface
- Easy to integrate
- Lightweight aluminum cooler
Products
Applications
SiC modules have excellent characteristics that enable high reverse voltage, low loss, high frequency operation and high temperature operation. With SiC power semiconductors, power consumption can be significantly reduced, and smaller and lighter products can be developed.
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